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1/12 msm6442 ? semiconductor general description the msm6442 is a 4-bit microcontroller with a built-in lcd controller/driver, developed to support control systems. the msm6442 is most suitable for various on-vehicle meters, watches, audio equipment, remote controllers, multifunctional telephones, and instrumentation units. features ? rom : 2048 words 8 bits ? ram : 128 words 4 bits ? i/o port input-output port : 4 ports 4 bits 1 port 2 bits input port : 1 port 1 bit ? lcd driver : 46 segments (static) : 92 segments (1/2 duty) ? stack (ram) : 16 levels ? four interrupt sources (external, clk, tbc, t/c) ? internal counter : 12-bit time base counter 8-bit programmable timer/event counter ? crystal and ceramic oscillation ? 76 instructions ? minimum instruction execution time : 952 ns @ 4.2 mhz ? operating range power supply voltage : 4.5 to 5.5 v (@ 4.2 mhz) 3.0 to 6.0 v (@ 1 mhz) operating temperature : C40 to +85 c ? supply current (typ.) : 6 ma (@ 5 v, 4.2 mhz) 1 ma (@ 3 v, 1 mhz) ? power down function : dependent on stop instruction ? package options: 80-pin plastic qfp (qfp80-p-1420-0.80-k): (product name : msm6442- gs-k) 80-pin plastic qfp (qfp80-p-1420-0.80-bk) : (product name : msm6442- gs-bk) indicates a code number. ? semiconductor msm6442 built-in lcd driver 4-bit microcontroller e2e0017-38-93 this version: sep. 1998 previous version: mar. 1996
2/12 msm6442 ? semiconductor block diagram ram 128 4 bits sp hl c acc alu inst dec rom 2048 8 bits pc p6 p5 p9 8-bit t/c intef pc intrqf pd int. cont pb t. c. 12-bit tbc wdt lcd t. c. clki t/c buffer reg lcd drv divider t. c. p4 p3 p1 p0 osc0 osc1 test1 test2 resout reset v dd gnd 32 10 32 10 32 10 32 10 cin intout int bz test3 xt xt seg1 seg46 com1 com2 vm lcdgnd
3/12 msm6442 ? semiconductor pin configuration (top view) 80-pin plastic qfp seg9 41 seg10 42 seg11 43 seg12 44 seg13 45 seg14 46 seg15 47 seg16 48 seg17 49 seg18 50 seg19 51 seg20 52 seg21 53 seg22 54 seg23 55 seg24 56 seg25 57 seg26 58 seg27 59 seg28 60 seg29 61 seg30 62 seg31 63 seg32 64 seg8 40 seg7 39 seg6 38 seg5 37 seg4 36 seg3 35 seg2 34 seg1 33 v dd 32 p1.3 31 p1.2 30 p1.1 29 cin /p1.0 28 p0.3 27 p0.2 26 p0.1 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 p0.0 test1 test2 int reset bz resout intout osc0 osc1 p4.3 p4.2 p4.1 p4.0 p3.3 p3.2 p3.1 p3.0 test3 xt xt gnd vm com2 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 seg33 seg34 seg35 seg36 seg37 seg38 seg39 seg40 seg41 seg42 seg43 seg44 seg45 seg46 lcdgnd com1
4/12 msm6442 ? semiconductor pin descriptions testing pin 1 (open) symbol type description p0.0 to p0.3 p1.0 to p1.3 p3.0 to p3.3 i/o pseudobidirectional configuration input-output ports (p1.0 is also used as count input cin ) p4.0 to p4.3 i/o pseudobidirectional configuration input-output port seg1 to seg16 o lcd segment output (can be assigned to data output in 4 bits) com1 o lcd common output 1 lcd common output 2 int i external interrupt input pin intout o interrupt request output pin reset i reset input pin resout o reset output pin bz o 2048 hz pulse output pin for buzzer osc0 i crystal or ceramic resonator connection (system clock) xt i 32.768 khz crystal oscillator connection (reference clock used for lcd control) test1 testing pin 2 (open) (connected to v dd ) testing pin 3 (open) v dd i power supply (5 v) lcdgnd i negative power supply for lcd vm i/o (v dd Clcdgnd)/2 supply voltage output or supply voltage input gnd i power supply (0 v) o o seg17 to seg46 lcd segment output com2 osc1 xt o o test2 test3 pin 28 to 31 11 to 14 33 to 48 80 21 17 20 18 19 16 5 23 32 79 2 3 49 to 78 1 15 4 22 6 24 to 27 7 to 10
5/12 msm6442 ? semiconductor absolute maximum ratings recommended operating conditions parameter symbol condition rating unit power supply voltage v dd ta = 25c C0.3 to +7 v input voltage v i C0.3 to v dd v output voltage v o C0.3 to v dd v lcd voltage lcdgnd v dd C 9 to v dd v storage temperature t stg C55 to +150 c parameter symbol condition range unit power supply voltage v dd f osc 1 mhz 3 to 6 v 4.5 to 5.5 v f osc 4.2 mhz lcd voltage lcdgnd v dd C 8 to 0 v *1 data-hold voltage v ddh 2 to 6 v oscillation off operating temperature t op C40 to +85 c lcd clock oscillation frequency f xt 32.768 khz *2 fan out (i/o port) n 15 mos load ttl load 1 *1 a voltage of (v dd Clcdgnd) volts is applied to lcd. *2 oscillation circuit for lcd clock (xt, xt pins) is for crystal oscillation only.
6/12 msm6442 ? semiconductor electrical characteristics dc characteristics parameter applied pin condition min. symbol typ. max. unit "h" input voltage int 2.4 v ih v dd v 3.6 v dd v "l" input voltage 0 v il 0.8 v "h" output voltage osc1 i o = C15 m a 4.2 v oh v i o = C400 m a 2.4 v seg1 to seg46 i o = C10 m a v dd -0.2 v com1, com2 i o = C50 m a v dd -0.2 v "l" output voltage i o = 1.6 ma v ol 0.4 v osc1 i o = 15 m a 0.4 v seg1 to seg46 i o = 10 m a 0.2 v com1, com2 i o = 50 m a 0.2 v "m" output voltage com1, com2 i o = 0.5 m a v dd /2 C 0.2 v om v dd /2 + 0.2 v "h" input current osc0 v i = v dd i ih 15 m a xt 7 m a int , reset 1 m a "l" input current osc0 v i = 0 v i il C15 m a xt 7 m a int , reset C30 m a "h" output current v o = 2.4 v C0.1 i oh ma v o = 0.4 v C1.2 ma power supply current (in stop mode) (32.768 khz, without crystal oscillator) v dd = 2 v,ta = 25c no load display off xt pin is fixed to "l" i dds 0.2 10 m a no load 1 100 m a display off xt pin is fixed to "l" power supply current (in stop mode) i ddl 100 200 m a power supply current i dd 612ma (v dd = 5 v 10%, lcdgnd = 0 v, ta = C40 to +85c) no load display off in stop mode f xt = 32.768 khz no load display off f osc = 4.2 mhz f xt = 32.768 khz *1 *3 *1, *4 *1 *2 *1, *2 *1 *1 applied to p0, p1, p3, and p4. *2 applied to intout , resout , and bz. *3 applied to osc0, xt, and reset . *4 applied to osc0, xt, int , and reset . note: "m" output voltage is an intermediate voltage that is output to the common pins during dynamic display. (vm pin is open.)
7/12 msm6442 ? semiconductor ac characteristics parameter symbol condition min. typ. max. unit clock (osc0) pulse width t f w 119 ns cycle time t cy 952 ns input data setup time t ds 120 ns input data hold time t dh *1 120 ns int input data pulse width t dw1 120 ns ct clock pulse width data delay time t dr c l = 15 pf 300 ns (v dd = 5 v 10%, ta = C40 to +85c) reset input pulse width t wrs *2 2 t cy ns t dw2 2/8 t cy + 120 ns *1 to release power down by inputting an "l" level into int pin, the pulse width should be longer than the time for the oscillation stabilization at osc0. *2 the condition of stable oscillation. to release power down by reset, the pulse width should be longer than the time for oscillation stabilization at osc0.
8/12 msm6442 ? semiconductor osc0 t f w t f w t cy osc0 p0, p1, p3, p4 osc0 p0, p1, p3, p4 int p1.0/ cin reset t ds t dh t dr input data t dw1 output data t dw2 t dw2 t wrs timing diagrams
9/12 msm6442 ? semiconductor output waveforms for lcd drivers static mode dynamic mode com1, com2 segn (n = 1 to 46) com1 to segn com2 to segn display off on off v dd lcdgnd v dd lcdgnd v dd Clcdgnd 0 = C(v dd Clcdgnd) display off com1 segn (n = 1 to 46) com1 to segn on off display off v dd lcdgnd v dd Clcdgnd vmClcdgnd 0 = C(vmClcdgnd) = C(v dd Clcdgnd) off on com2 com2 to segn v dd vm lcdgnd v dd vm lcdgnd v dd Clcdgnd vmClcdgnd 0 = C(vmClcdgnd) = C(v dd Clcdgnd) display off
10/12 msm6442 ? semiconductor notes on use notes on using ports 5 and 6 of msm6442 the msm6442 uses port 5 (p5) and port 6 (p6) to rewrite the display in the lcd and the dedicated registers in lcd section, and to read the interrupt indication flag. writing and reading is completed when data has been written using p5 and p6, in this order successively. therefore, if an interrupt occurs during operation of p5 and p6 and these ports are operated by the interrupt routine, the msm6442 may not operate normally. countermeasure disable a process interruption during operation of p5 and p6. make the program interrupt disabled when rewriting the display in lcd, rewriting a dedicated register such as the system control register (scr), or reading/resetting the interrupt indication flag. note that the program examples provided in the user's manual use the assumption that each program is in the interrupt disabled state. therefore, when executing any of the program examples in the interrupt enabled state, execute the mdi and mei instructions according to the following examples: (1) writing data into a dedicated register lai m set write data m mdi disable interrupt (*1) opd 6 lai n set control command n opd 5 mei enable interrupt (*2) rpbd 5, 3 end of write processing (2) reading the interrupt indication flag lai 0fh mdi disable interrupt (*1) opd 6 lai 0ah set control command 0ah opd 5 ipd 6 read flag mei enable interrupt (*2) rpbd 5, 3 end of read processing *1 if an accumulator is not saved during interrupt processing, the mdi instruction must be executed before the lai instruction is executed. *2 during actual processing, an interrupt is enabled after the execution of the rpbd 5, 3 instruction.
11/12 msm6442 ? semiconductor (unit : mm) package dimensions notes for mounting the surface mount type package the sop, qfp, tsop, soj, qfj (plcc), shp and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 1.27 typ. qfp80-p-1420-0.80-k mirror finish
12/12 msm6442 ? semiconductor (unit : mm) notes for mounting the surface mount type package the sop, qfp, tsop, soj, qfj (plcc), shp and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). qfp80-p-1420-0.80-bk package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 1.27 typ. mirror finish

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